TSMC revealed its general manufacturing technology roadmap through 2029 at its North American Technology Symposium 2026 on Wednesday. Among the key highlights the company presented were its 1.2nm and 1.3nm-class fabrication processes called A12 and A13, an unexpected extension of the N2 family named N2U, and the lack of plans to use High-NA EUV lithography for any nodes through 2029. Perhaps the most notable part of the technology-related announcement was firming the multi-faceted approach to new node development.
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