
Due to the elongated shape of LGA 1700 CPUs and how they are secured in the socket, 12th-14th Gen Intel Core CPUs have been known to bend or warp while installed in the motherboard’s socket. This can cause higher temperatures due to uneven contact with CPU coolers.
So Thermal Grizzly, Thermalright, and others have released complete replacements for the ILM (Independent Loading Mechanism, the CPU locking hardware) of the LGA1700 socket in recent years. We tested Thermalright’s LGA1700-BCF contact frame and saw a reduction of temperatures of up to 12C on an Asus TUF Gaming Z790 Plus motherboard when paired with an Intel Core i9-13900K.