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HISTORICAL FACTS: 6 - Caught on Camera

In China, AMD CEO Lisa Su is understated while Nvidia's Huang is more razzmatazz

AMD CEO Lisa Su visited China, adopting a low-profile approach. This contrasts with Nvidia CEO Jensen Huang's more public engagement. Their differing strategies reflect the complex AI chip market in China. AMD offers a broader product range, while Nvidia faces significant export control challenges. Both companies are making investments in…

The Economic Times

How China's electronics giant Huawei plans to take on its rivals with a chip design breakthrough

China's electronics giant Huawei is pioneering a new chip design approach. This method focuses on reducing signal transmission time instead of shrinking transistors. The company aims to boost performance and energy efficiency. This innovation could help Huawei bypass US sanctions. High-end chips are expected by 2031. This marks a significant…

The Economic Times

The end of Moore's Law? Huawei unveils new chip architecture, which it hopes can help it cut the gap on Nvidia and TSMC

Huawei introduced Tau Scaling Law and LogicFolding architecture as potential alternatives to Moore’s Law and traditional semiconductor scaling limitations.

TechRadar

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Energy use forcing rethink of AI chip design, TSMC says

AI's massive electricity needs are now driving chip development. Energy efficiency is becoming more critical than raw computing power. TSMC, a leading chipmaker, sees customers prioritizing performance gains that use less power. This shift impacts smartphones to AI data centers. New technologies like advanced packaging and chip stacking are key.…

The Economic Times

Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management

The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.

Tom’s Hardware

Huawei Named a Leader in the 2026 Gartner® Magic Quadrant™ for Enterprise Wired and Wireless LAN Infrastructure for the Fourth Year in a Row

SHENZHEN, China, May 28, 2026 /PRNewswire/ -- Recently, Huawei announced that it has been named a Leader in the 2026 Gartner® Magic Quadrant™ for Enterprise Wired and Wireless LAN Infrastructure for the fourth year in a row. Huawei remains the only non-North American vendor positioned in the Leaders Quadrant. This…

AAP

T3 Awards 2026 shortlist: Your contenders for this year's main event

Top products have been nominated for this year's T3 Awards, but who will win?

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Huawei Watch Fit 5 Pro review: A slim, powerful Apple Watch alternative

The Huawei Watch Fit 5 Pro is nicely designed, accurate and pleasant to wear.

TechRadar

China adds homegrown AI chips to 'secure and reliable' procurement list for the first time — nine options added as move away from Nvidia continues

The certifications are valid for three years and were issued jointly by the China Information Technology Security Evaluation Centre and the National Secrecy Science and Technology Evaluation Centre.

Tom’s Hardware

The 2026 Fortune Most Powerful Women list is here—and 11 CFOs made the cut

Huawei's Meng Wanzhou, Microsoft's Amy Hood, Meta's Susan Li, Alphabet's Anat Ashkenazi, and Nvidia's Colette Kress all land in the top 50.

Fortune

Enlit Africa 2026: Huawei Launches Intelligent Substation Solution for Sub-Saharan Africa

CAPE TOWN, South Africa, May 27, 2026 /PRNewswire/ -- On May 20, Huawei hosted the Southern Africa Electric Power Summit at Enlit Africa 2026—the continent's premier gathering for the power, water, and energy sectors. Under the theme "Building Future Power Systems, Unleashing Surging Digital Intelligence Productivity", the summit brought together…

AAP

Nvidia CEO Jensen Huang Says US Chip Restrictions Helped Chinese AI Companies Grow

Nvidia CEO Jensen Huang claims US export restrictions on semiconductors have accelerated China's AI industry growth, allowing companies like Huawei to fill the market gap left by Nvidia.

International Business Times UK

Global Market: Chinese AI and chip stocks rally after Huawei signals major tech leap

Chinese semiconductor stocks surged in Hong Kong following Huawei's announcement of a potential 1.4nm chip breakthrough using "LogicFolding" technology by 2031. This development aims to narrow the gap with global leaders and bolster China's AI ambitions amid US restrictions. While promising, the technology's commercial viability remains to be seen, with…

The Economic Times

Tech Brief (May 26): Huawei Targets 1.4-Nanometer Chip Performance by 2031 With New Design Architecture

Unitree fast-tracks Shanghai IPO with target valuation of $6.2 billion, DeepSeek cuts flagship AI model prices by 75% as funding round looms

Caixin Global

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International Business Times

Huawei Claims Chip Design Breakthrough As US-China Tech Rivalry Intensifies

The announcement comes as global chipmakers race toward sub-2-nanometer technology amid escalating US-China technology restrictions and rising AI demand.

AAP

Huawei Hosts 3rd Global C&I Visionaries Summit, Shaping a Greener Future Across Diverse Industries

DONGGUAN, China, May 26, 2026 /PRNewswire/ -- Huawei Digital Power hosted the 3rd Global C&I Visionaries Summit, a four-day event featuring Dawn and Horizon sessions. Over 800 participants from 50 countries explored cultural value, strategy & new product launch, cutting-edge commercial and industrial (C&I) solutions, and success stories, shaping future…

Euronews

Portugal's Meo seeks €82m from state over Huawei 5G exclusion

Portuguese telecoms operator Meo is taking the state to court over its decision to ban Huawei equipment from 5G networks, arguing the move caused serious financial damage.

The Economic Times

Huawei touts new chipmaking technology to sidestep US restrictions

Chinese tech giant Huawei said on Monday it had developed a new way of making semiconductors that could get around its US-enforced lack of access to the most advanced chipmaking equipment. Huawei has been at the centre of a geopolitical standoff in recent years after Washington warned its equipment could…

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The Economic Times

She got $400 million and a dream; now she's the woman who defied America's tech blockade - who is China's 'Chip Queen'?

She was handed $400 million and one impossible mission — make Huawei independent from foreign chips. Years later, He Tingbo emerged as China’s powerful “Chip Queen,” leading the company through brutal US sanctions and America’s tech blockade. From building Kirin processors to driving Huawei’s AI future, her rise has become…

Tom’s Hardware

Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law

Huawei Technologies unveiled a new “LogicFolding” chip design framework built on its proprietary Tau scaling law, claiming it can dramatically boost transistor density and power efficiency without EUV lithography — potentially helping China narrow the gap with TSMC and Nvidia despite U.S. sanctions.

Android Central

Five reasons the Huawei Watch Fit 5 Pro is my go-to smartwatch

Need a smartwatch that's different? You should take a look at Huawei's Watch Fit 5 Pro.

The Economic Times

Huawei's 'chip queen' etches her name in China's tech folklore

He Tingbo, Huawei's "chip queen", spearheads the company's semiconductor innovation. Facing U.S. sanctions, Huawei is developing new chip technologies. He Tingbo introduced the Tau Scaling Law, focusing on transmission speeds. This effort aims for self-reliance and continued technological advancement for China.

The Economic Times

Huawei proposes new path for chip development amid US sanctions

Huawei aims for advanced chip design by 2031. The company is developing a new 'Tau Scaling Law' to improve chip performance. This innovation could bypass US sanctions restricting access to cutting-edge semiconductor technology. Huawei's upcoming Kirin chips will feature a related 'LogicFolding' architecture. The company has already produced hundreds of…

Tom’s Hardware

Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the limitations…

AAP

HiFS 2026: Upgrading Four Major Digital Finance Solutions to Accelerate Financial Institutions Toward Agentic Banking

SHANGHAI, May 23, 2026 /PRNewswire/ -- The Huawei Intelligent Finance Summit (HiFS) 2026 (Global Session), themed "Hello Fintelligent World: Beyond Digital, Advance to Agentic Banking," opened today at Huawei's Lianqiu Lake Campus in Shanghai. At the summit, Huawei announced six key initiatives to accelerate the large-scale deployment of financial AI,…

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