TSMC is set to start installing equipment into its 2nm-capable fab in the Hsinchu Science Park in April 2024, according to a statement made by the park director, according to LTN (via @DanNystedt). This might confirm a significant development for the TSMC N2 project, as the company has never published any exact timelines for this fab.
Albeit symbolic, equipment move-in is a significant milestone in fab building. It typically takes a year to equip a fab. But when it comes to TSMC's N2 process, it requires multiple Twinscan NXE extreme ultraviolet (EUV) lithography tools from ASML that need installation either by TSMC or by ASML and then validation by the former, which takes time. This information comes from an unofficial source, so take it with a grab of salt.
